Let's talk!

PCB BOARD COMPONENT LAYOUT CLONING

  • click to rate

    PCB Board Component Layout Cloning is a critical step for printed circuit board reverse engineering, since it will refer the arrangement of each electronic/mechanical locations on the board which can greatly affect the performance of electronic appliance. Reverse Engineering Circuit Board

    Since manual pcb board layout is used, the first step is to place the components and parts on the PCB board. Separate noise-sensitive components and noise-producing components. There are two criteria for accomplishing this task:

    1. Divide the Component in the circuit schematic into two categories: high-speed (>40MHz) devices and low-speed devices. If possible, place high-speed components as close as possible to the circuit board’s connectors and power supply.                                                                                                                                        
    2. Divide the above categories into three sub-categories: pure digital, pure analog and mixed signal. Place the digital devices as close as possible to the connectors and power supply of the board.

    CLONING ANTI-ESD CIRCUIT BOARD GERBER FILE

    Cloning anti-esd Circuit Board Gerber File needs to pay attention to its layout design, which will use multi-layer PCB design as much as possible. Reverse Engineering Printed Circuit Board 

    Compared with double-sided PCB board cloning, the ground plane and power plane, as well as the tightly arranged signal line-ground spacing can reduce common mode impedance and inductive coupling, making it 1/of the double-sided PCB. 10 to 1/100.

    Try to put each signal layer close to a power layer or ground layer. For high-density interconnect PCB board reverse engineering with components on the top and bottom surfaces, short connection lines, and many filling grounds, you can consider using inner layer lines.

    For double-sided PCBs, tightly interwoven power and ground grids are used. The power line is close to the ground line, and as many connections as possible between the vertical and horizontal lines or the filled area. The grid size on one side is less than or equal to 60mm. If possible, the grid size should be less than 13mm. PCB Reverse engineering service

    Make sure that each circuit is as compact as possible, put all the connectors aside as much as possible, and if possible, lead the power cord into the center of the card and away from areas that are directly affected by ESD.